Molecules are among the smallest building blocks available for making next-generation devices. Their unique, customizable properties enable promising applications in emerging computing, sensing, optical, and quantum technologies. But integrating molecules into functional devices at scale remains a challenge. Traditional semiconductor manufacturing processes can damage small and fragile molecular materials. Now, MIT researchers have developed a scalable fabrication technique that incorporates delicate molecular materials into electronic devices on a chip without causing damage. Their method extends the capabilities of standard semiconductor manufacturing processes to accommodate molecules. The researchers first prefabricate the device components using traditional processes. Then, they introduce the molecules and harness nanoscale surface forces to mechanically transform the fabricated device, which self-assembles without damaging the molecules. 'Our platform combines the scalability...
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